产品展示
- 层数:3层
Number of layers:3layers
板厚:2.2mm
Thickness:2.2mm
最小孔径:12m
Min. hole:1.2mm
材料:RT5880
Base material: RT5880
技术特点:混压、阶梯
Technical Feature:Mixlamination,step
- 层数:8层
Number of layers: 8 layers
板厚:36mm
Thickness:3.6mm
最小孔径:0.6mm
Min.hole:0.6mm
材料:Dicla880
Base material: Diclad880
技术特点:混压、多层阶梯、镀厚金
Technical Feature:Mix lamination,multi-step, thick gold plating
- 层数:2层
Numberof layers:2layers
板厚:1.0mm
Thickness:1.0mm
最小孔径:0.8mm
Min. hole:0.8mm
材料:TLY-5
Base material:TLY-5
技术特点:阶梯槽
Technical Feature: Step slot
- 层数:3层
Number of layers:3 layers
板厚:32mm
Thickness:3.2mm
最小孔径:3.0mm
Min.hole:3.0mm
材料:RO4350
Base material:RO4350
技术特点:混压、阶梯
TechnicalFeature:Mix lamination,step